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  • Institute of Microelectronics,Tsinghua Univ....
    http://dns.ime.tsinghua.edu.cn/english/education/2.htm

  • Packaging standards will help vendors to slash costs (March 2002) - FibreSystems...
    http://fibers.org/articles/fs/6/3/5/1

  • Packaging standards will help vendors to slash costs (May 2002) - FibreSystems -...
    http://fibers.org/articles/fs/6/5/5/1

  • Cookies Required...
    http://link.aip.org/link/

  • November 1996 Newlsetter...
    http://msrc.wvu.edu/CPMT/vol96.4.html

  • Nano ...
    http://serve.me.nus.edu.sg/nano-wlp/Brochure/NWLP%20Brochure.pdf

  • The Chip Collection - IC Packaging 1982 Series 9 - Smithsonian Institution...
    http://smithsonianchips.si.edu/ice/package.htm

  • The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC P...
    http://webbooks.net/books/_Kluwer/Kelly,%20G.html

  • Commercial Integrated Circuit Technology in Defense Systems...
    http://www.acq.osd.mil/es/dut/ic/sect3.htm

  • A novel Packaging Concept for RF-MEMS Components ...
    http://www.acreo.se/upload/Publications/Proceedings/OE01/01-ENOKSSON.pdf

  • Failure-Free Integrated Circuit Packages...
    http://www.calce.umd.edu/general/published/books/descriptions/failurefree.h

  • Workshop on MEMS Sensor Packaging ...
    http://www.campus-micro-technologies.de/documents/Delta_Workshop.pdf

  • IEEE/CPMT Short Course: Thermal Management...
    http://www.cpmt.org/scv/courses/thermal.html

  • IEEE Transactions on Electronics Packaging Technology...
    http://www.cpmt.org/trans/trans-epm.html

  • Machine Vision and Applications (1998) 11: 37­41 Machine Vision and ...
    http://www.cs.ucf.edu/~zhou/die_ext.pdf

  • Die Products Consortium ...
    http://www.dieproducts.org/pdf/DPC_Presentation.pdf

  • Langis Roy: Publications...
    http://www.doe.carleton.ca/~lroy/publications.html

  • THERMINIC: New Methods for Thermal Investigation of Integrated Circuits...
    http://www.eet.bme.hu/projects/therminic.html

  • ME477 Fall 2004 ...
    http://www.egr.msu.edu/~pkwon/me477/ICProcessing.pdf

  • Electronic Packaging: BGA, MCMs, Chip-on-Board and Flip-Chip Technologies...
    http://www.electronics.ca/reports/microelectronics/GB235.html

  • Cours conception assistée, Génie électique, Doctorats, FESP...
    http://www.etudesup.uottawa.ca/programmes/doctorats/genie_electrique/cours_

  • Amkor Confidential ...
    http://www.ewh.ieee.org/soc/cpmt/presentations/cpmt0403.pdf

  • DAT ...
    http://www.flowcad.de/datasheets/Cadence_APD_APE_Packaging.pdf

  • GIST - Integrated Circuit Design...
    http://www.gist.edu.sg/ICD/icdPrg.htm

  • U.D.C. 621.3.049.774'14-217:621.315.616.96-418.5:621.911 ...
    http://www.hitachi-cable.co.jp/en/review/20/review12.pdf

  • IMAPS 2003 - Monday PDCs, November 17, 2003...
    http://www.imaps.org/imaps2003/pdc_monday.htm

  • IC Technology...
    http://www.imec.be/mtc/newpage11.htm

  • JCN Network - News Search...
    http://www.japancorp.net/Article.Asp

  • DATASHEET ...
    http://www.logmatic.ch/downloads/allegro_pdpsi610_ds.pdf

  • MANCEF International Roadmap...
    http://www.mancef.org/roadmap1.htm

  • 608 IEEE TRANSACTIONS ON ADVANCED PACKAGING, VOL. 23, NO. 4, NOVEMBER 2000 ...
    http://www.me.berkeley.edu/~lwlin/papers/IEEE-2000pac.pdf

  • Bonding ...
    http://www.me.umn.edu/education/courses/me8243/Lecture_10_Bonding_packaging

  • Bonding, Packaging, and Integration ...
    http://www.me.umn.edu/education/courses/me8243/Lecture_10b_Bonding.pdf

  • Mead Training - USA...
    http://www.mead.ch/htm/ch/bios_texte/RF05_text.html

  • Advanced Packaging-Megatec...
    http://www.megatec.co.il/advanced_packaging/advanced_packaging.asp

  • Characterization of Imperfect Interfaces in IC Packaging using Deconvolved Ultra...
    http://www.ndt.net/article/apcndt01/papers/1162/1162.htm

  • NDE of Moisture in Encapsulant resin of IC Packages by Microwaves...
    http://www.ndt.net/article/wcndt00/papers/idn274/idn274.htm

  • Allegro Package Designer and Allegro Package SI...
    http://www.parallel-systems.co.uk/allegro_package_designer_allegro_package_

  • DATASHEET ...
    http://www.parallel-systems.co.uk/pdf/allegro_pdpsi610_ds.pdf

  • EXCEL SkyScan 1080/81 ...
    http://www.sea.rl.ac.uk/NewSEA/newpubs/excel/excel_factfile.pdf

  • Glossary of Acronyms Relevant to Electronics Manufacturing ...
    http://www.smta.org/files/acronym_glossary.pdf

  • Wafer Brochure 7/1/04 4:23 PM Page 1 ...
    http://www.smta.org/files/iwlpc04_program.pdf

  • SMTA - The Surface Mount Technology Association...
    http://www.smta.org/store/book_detail.cfm

  • packaging...
    http://www.stanford.edu/group/microheat/five.html

  • MEASUREMENT SYSTEM FOR LOW FORCE ...
    http://www.stanford.edu/~wtpark/PRU70.pdf

  • Advanced IC Interconnect and Packaging: Materials and Processing Issues ...
    http://www.ucop.edu/research/micro/01_02/01_080.pdf

  • IC Packaging/Intro ...
    http://www.ul.ie/~rinne/ee6471/ee6471%20wk8.pdf

  • Chipdir - chip package...
    http://www.xs4all.nl/~ganswijk/chipdir/package.htm

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